Mobile chip giant Qualcomm has moved to strengthen its position in the nascent IoT market via a joint-venture with Japanese electronics company TDK to create embedded radio modules.

Scott Bicheno

January 13, 2016

2 Min Read
Qualcomm forms IoT radio module joint-venture with TDK

Mobile chip giant Qualcomm has moved to strengthen its position in the nascent IoT market via a joint-venture with Japanese electronics company TDK to create embedded radio modules.

The company will be called RF360 Holdings and be registered in Singapore. It is being formed to provide RF font-end modules and RF filters into industries such as mobile devices, IoT, automotive, drones, etc. Qualcomm brings its general RF expertise while TDK is strong on filtering and module integration. The two will also collaborate on sensors and wireless charging.

“TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications,” said Steve Mollenkopf, CEO of Qualcomm.

“The joint venture’s RF filters will bolster Qualcomm RF36 front-end solutions to enable Qualcomm to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe.”

“The joint venture with Qualcomm is a win for both companies, which complement each other ideally,” said Takehiro Kamigama, CEO of TDK. “Customers will benefit from our unique and comprehensive portfolio, which will further strengthen TDK’s position in key growth business segments and open new and exciting business opportunities. In this context, it was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules.”

The ultimate aim of this JV, which isn’t expected to come into effect for another year or so, is to deliver the kind of multi-tech Snapdragon-type SoCs Qualcomm has been making for smartphones to embedded applications in other industries. An IoT module will ideally support all types of connectivity, including the various generations of mobile, wifi, Bluetooth, etc, and Qualcomm seems to have decided it’s best chance of getting ahead of the game in the great IoT land grab is through this partnership.

About the Author(s)

Scott Bicheno

As the Editorial Director of Telecoms.com, Scott oversees all editorial activity on the site and also manages the Telecoms.com Intelligence arm, which focuses on analysis and bespoke content.
Scott has been covering the mobile phone and broader technology industries for over ten years. Prior to Telecoms.com Scott was the primary smartphone specialist at industry analyst Strategy Analytics’. Before that Scott was a technology journalist, covering the PC and telecoms sectors from a business perspective.
Follow him @scottbicheno

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