TriQuint Introduces TRITIUM Duo™

TriQuint Introduces TRITIUM Duo™, Smallest Dual-Band

Power Amplifier Solution for 3G and 4G Smartphones

New family offers mix-and-match two-band combinations, giving mobile device manufacturers a flexible, high-performance platform that speeds time to market 

HILLSBORO, OREGON (USA) – February 20, 2012 – TriQuint Semiconductor, Inc. (NASDAQ: TQNT), a leading RF solutions supplier and technology innovator, today unveiled the industry’s smallest dual-band PA duplexer (PAD) for global 3G and 4G smartphones. The new TRITIUM Duo™ family combines two band-specific power amplifiers (PAs) and duplexers in a single compact module, effectively replacing up to twelve discrete components.

“We’ve powered the world’s top smartphones with over a half billion of our single-band TRITIUM™ modules, and now the TRITIUM Duo™ is being evaluated by customers for use in next generation smartphones,” said Ralph Quinsey, president and chief executive officer of TriQuint. “Our broad technology portfolio has enabled us to integrate two commonly used bands in one small footprint. Not only have we simplified the RF front-end for phone designers, we have also increased performance and flexibility.”

The TRITIUM Duo family shares a common 6 x 4.5mm footprint, giving designers the flexibility to support multi-band, multi-mode operations across multiple platforms. Mobile device manufacturers can capitalize on the dramatic size reductions to include more features or larger batteries in thinner, lighter form factors with all the performance needed for CDMA, 3G, and 4G networks.

TriQuint’s TRITIUM Duo family provides several key benefits to mobile device vendors:

Significant Integration Enabled by Industry’s Broadest Technology Portfolio

The new dual-band TRITIUM Duo implements proprietary TriQuint CuFlip™ technology to replace wire bonds with copper bumps; this saves board real estate and enables superior system performance by eliminating noise-radiating wires. The copper bumps also dissipate heat better than traditional interconnect techniques. The integrated Flip Chip BiHEMT power amplifier die achieves industry leading current consumption to provide maximum talk-time and thermal efficiency critical for smartphone applications.

The new TRITIUM Duo also employs a wafer level packaging (WLP) technique to provide hermetic filter encapsulation for improved performance and a reduced size. In addition, the modules integrate high-performance BAW and SAW duplexer capabilities.

TriQuint will showcase its mobile device platform solutions, including the new TRITIUM Duo family, at the communications industry’s largest annual trade show, the GSMA Mobile World Congress, in Barcelona, Spain, on February 27 – March 1, 2012. The TRITIUM Duo is currently sampling, with volume production planned in June. To locate one of TriQuint’s distributors, resellers or local and field sales representatives, please visit www.triquint.com/sales.

This streamlined dual-band TRITIUM Duo family brings an even higher level of integration to TriQuint’s portfolio of award-winning PA-duplexer modules. An industry pioneer in integrating passive and active devices, TriQuint provides complete, high performance RF front-end solutions by integrating amplifiers, filters and switches. The TRITIUM Duo™ combines with TriQuint’s QUANTUM Tx™ family of transmit modules to offer a complete RF front-end solution for smartphones and other mobile devices.

FORWARD LOOKING STATEMENTS
This TriQuint Semiconductor, Inc. (NASDAQ: TQNT) press release contains forward-looking statements made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Readers are cautioned that forward-looking statements involve risks and uncertainties. The cautionary statements made in this press release should be read as being applicable to all related statements wherever they appear. Statements containing such words as ‘leading’, ‘smallest’, ‘superior’, or similar terms are considered to contain uncertainty and are forward-looking statements. A number of factors affect TriQuint’s operating results and could cause its actual future results to differ materially from any results indicated in this press release or in any other forward-looking statements made by, or on behalf of, TriQuint including, but not limited to: those associated with the unpredictability and volatility of customer acceptance of and demand for our products and technologies, the ability of our production facilities and those of our vendors to meet demand, the ability of our production facilities and those of our vendors to produce products with yields sufficient to maintain profitability, as well as the other “Risk Factors” set forth in TriQuint’s most recent 10-Q report filed with the Securities and Exchange Commission. This and other reports can be found on the SEC web site, www.sec.gov. A reader of this release should understand that these and other risks could cause actual results to differ materially from expectations expressed / implied in forward-looking statements.

FACTS ABOUT TRIQUINT
Founded in 1985, TriQuint Semiconductor (NASDAQ: TQNT) is a leading global provider of innovative RF solutions and foundry services for the world’s top communications, defense and aerospace companies. People and organizations around the world need real-time, all-the-time connections; TriQuint products help reduce the cost and increase the performance of connected mobile devices and the networks that deliver critical voice, data and video communications. With the industry’s broadest technology portfolio, recognized R&D leadership, and expertise in high-volume manufacturing, TriQuint creates standard and custom products using gallium arsenide (GaAs), gallium nitride (GaN), surface acoustic wave (SAW) and bulk acoustic wave (BAW) technologies. The company has ISO9001-certified manufacturing facilities in the U.S., production in Costa Rica, and design centers in North America and Germany. For more information, visit www.triquint.com.

TriQuint: Connecting the Digital World to the Global Network^®